Printed circuit board design utilizing flexible interconnects fo

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428901, 174254, 174260, 361827, 29832, B32B 900

Patent

active

056227701

ABSTRACT:
A system for modifying a printed circuit board allows parallel design of the printed circuit board and a programmable gate or logic array used on the circuit board. The printed circuit board design can be fixed before the gate array design is complete, which allows for flexibility in pin assignments of the high density integrated circuit mounted on the circuit board. Each pin of the gate array that can vary has a pair of vias connected by a conductive track. Changing signal paths requires cutting this track and using a jumper to make the new connection.

REFERENCES:
patent: 4640010 (1987-02-01), Brown
patent: 4743489 (1988-05-01), Hasegawa
patent: 5118556 (1992-06-01), Makino et al.
patent: 5196268 (1993-03-01), Fritz
patent: 5306541 (1994-04-01), Kasatani

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Printed circuit board design utilizing flexible interconnects fo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit board design utilizing flexible interconnects fo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board design utilizing flexible interconnects fo will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-340292

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.