Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1983-07-13
1986-09-09
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156656, 1566591, 1566611, 156666, 156902, 29852, 174 685, 427 97, 430313, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
046107568
ABSTRACT:
The printed circuit board is produced without soldering lands around the contacting, supporting or interconnecting holes of a simple faced, double-faced or multilayer circuit.
The inner wall of the hole is covered with a copper layer which extends only until the free surface of the naked board, i.e. levels that surface, or does not fully extend until this level. The said layer is covered with a tin-lead metallisation layer which serves as a soldering link element. The solder mounts towards the wire or pin of the soldered component but does not touch nor spoil the free, insulating surface of the support.
One necessary condition of the making process of the board is the precise, clean, proper and sharp drilling of the holes.
REFERENCES:
patent: 3702284 (1972-11-01), Merkenschlager
patent: 3772101 (1973-11-01), Chumbres
patent: 4179800 (1979-12-01), Takaba et al.
IBM Technical Disclosure Bulletin, vol. 13, No. 1, Jun. 1970, New York, NY, R. H. Mead: "Landless plated through-hole process", p. 181.
Cirtech S.A.
Powell William A.
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