Printed circuit board and method thereof and a solder ball...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

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Details

C257S780000

Reexamination Certificate

active

07576438

ABSTRACT:
A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.

REFERENCES:
patent: 3871014 (1975-03-01), King et al.
patent: 5598036 (1997-01-01), Ho
patent: 5641946 (1997-06-01), Shim
patent: 5864470 (1999-01-01), Shim et al.
patent: 6184062 (2001-02-01), Brofman et al.
patent: 6291895 (2001-09-01), Taniguchi et al.
patent: 6350669 (2002-02-01), Pu et al.
patent: 6713871 (2004-03-01), Searls et al.
patent: 6781245 (2004-08-01), Huang
patent: 6879041 (2005-04-01), Yamamoto et al.
patent: 7125745 (2006-10-01), Chen et al.
patent: 2003/0193094 (2003-10-01), Takahashi et al.
patent: 2007/0023610 (2007-02-01), Kim et al.
patent: 2004-165376 (2004-06-01), None
patent: 2004-165375 (2004-09-01), None

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