Printed circuit board and method of preparing same

Details Printed circuit board and method of preparing same Printed circuit board and method of preparing same

1988-09-02

1991-05-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 156634, 156656, 1566591, 156902, 156151, 156153, 156233, 156249, B44C 122, C23F 100, C03C 1500, C03C 2506

Patent

active

050133977

ABSTRACT:
A method of forming printed circuits on an insulating film comprising the steps of forming a panel plating layer, plating the circuits onto the panel plating layer, applying a film to the plated panel plating layer and chemically removing the panel plating layer. In addition, the printed circuit is impressed into the film so as to form a planar surface and a protective film is placed over the film and impressed circuit. The method of making a thermocouple by this process is also disclosed.

REFERENCES:
patent: 4159222 (1979-06-01), Lebow et al.
patent: 4584039 (1986-04-01), Shea
patent: 4604160 (1986-08-01), Murakami et al.
patent: 4722765 (1988-02-01), Ambros et al.
patent: 4789423 (1988-12-01), Pelligrino
patent: 4790902 (1988-12-01), Wada et al.

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