Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1994-06-24
1995-12-05
Gallagher, John J.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156313, 216 33, 427 98, 427305, B44C 122
Patent
active
054725631
ABSTRACT:
The present invention provides a printed circuit board which is high in acid resistance, mechanical strength at high temperature and bond strength, a method for making the printed circuit board and an apparatus used for making the printed circuit board. The technique of the present invention is characterized in that a metallic film having metal particles discretely distributed therein is provided on a roughened surface of copper circuit pattern on an insulating substrate which has been oxidized to form copper oxide and thereafter reduced.
REFERENCES:
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patent: 4002778 (1977-01-01), Ballis et al.
patent: 4180608 (1979-12-01), Del
patent: 4225379 (1980-09-01), Ishii et al.
patent: 4434022 (1984-02-01), Kamada et al.
patent: 4554184 (1985-11-01), Canestaro et al.
Akahoshi Haruo
Kawaguchi Masami
Kogawa Kiyonori
Nagai Akira
Ooki Nobuaki
Gallagher John J.
Hitachi , Ltd.
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