Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits
Patent
1986-04-21
1987-04-28
Nimmo, Morris H.
Electricity: conductors and insulators
Conduits, cables or conductors
Single duct conduits
29852, 156656, 1566591, 427 97, H05K 100
Patent
active
046616543
ABSTRACT:
The printed circuit board is produced without soldering lands around the contacting, supporting or interconnecting holes of a simple faced, double-faced or multilayer circuit.
The inner wall of the hole is covered with a copper layer which extends only until the free surfaces of the naked board, i.e. levels that surface, or does not fully extend until this level. The said layer is covered with a tin-lead metallization layer which services as a soldering link element. The solder mounts towards the wire or pin of the soldered component but does not touch nor spoil the free, insulating surface of the support.
One necessary condition of the making process of the board is the precise, clean, proper and sharp drilling of the holes.
REFERENCES:
patent: 3268653 (1966-08-01), McNutt
patent: 3702284 (1972-11-01), Merkenschlager
patent: 3772101 (1973-11-01), Chumbres et al.
patent: 4104111 (1978-08-01), Mack
patent: 4179800 (1979-12-01), Takaba et al.
patent: 4360570 (1982-11-01), Andreades et al.
patent: 4610756 (1986-09-01), Strobel
Mead, R. H., Landless Plated Through-Hole Process, IBM Technical Disclosure Bulletin, vol. 13, No. 1, Jun. 1970, p. 181.
Cirtech S.A.
Nimmo Morris H.
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