Printed circuit assembly with contact dot

Details Printed circuit assembly with contact dot Printed circuit assembly with contact dot

1989-08-21

1990-05-15

Schor, Kenneth M.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156664, 156666, 156901, 156902, 156630, 228254, H05K 306

Patent

active

049255223

ABSTRACT:
A method of making printed circuit boards having gold dot contacts formed on the terminal pads is disclosed. A first layer of copper is overlayed with a pattern of tin or solder which acts as a resist. The gold dot contacts are resistance welded to the terminal pads. The copper underlayment and its pattern of tin or solder carrying the gold dots is then bonded to an electrically insulating substrate, which can be flexible, to form a composite board which is then etched to form a printed circuit board having gold dot contacts thereon. Other materials than tin or solder can be employed so long as there is a difference in etchability between it and the copper foil.

REFERENCES:
patent: 3382575 (1968-05-01), Gannoe
patent: 3728178 (1973-04-01), Caule
patent: 4404509 (1983-09-01), Livshits et al.
patent: 4543153 (1985-09-01), Nelson

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