Printed circuit and fabrication of same

Details Printed circuit and fabrication of same Printed circuit and fabrication of same

1988-06-22

1992-03-17

Nimmo, Morris H.

Electricity: electrical systems and devices

Miscellaneous

174255, 174258, 174261, 361414, H05K 111

Patent

active

050973908

ABSTRACT:
Apparatus and method for protecting intermediate layers of a multi-layer printed circuit board from chemical or other damage from processing of a layer or layers to which previously fabricated layers of the printed circuit board are attached prior to such additional processing. A thin layer of protective material is selectively attached to intermediate or inner layers of a multi-layer printed circuit board after fabrication of such layers, when the outer or subsequent layers are attached. Inner or intermediate layer(s) of a multi-layer printed circuit board are fabricated. When outer layer(s) of the resulting printed circuit board are attached to the inner or intermediate layer(s), a layer of protective material such as a thin sheet of chemical-resistive plastic is disposed between the inner or intermediate layer(s) and the outer layer(s) and is selectively or completely attached or bonded thereto such as with a layer of acrylic adhesive.

REFERENCES:
patent: 3105869 (1963-10-01), Branch et al.
patent: 3228091 (1966-01-01), Rice et al.
patent: 3409732 (1968-11-01), Dahlgren et al.
patent: 3471348 (1969-10-01), Shaheen et al.
patent: 3772776 (1973-11-01), Weisenburger
patent: 3851382 (1974-12-01), Stork
patent: 3888745 (1975-06-01), Hojyo
patent: 3939558 (1976-02-01), Riley
patent: 3999285 (1976-12-01), Lewis et al.
patent: 4026011 (1977-05-01), Walton
patent: 4037047 (1977-07-01), Taylor
patent: 4063993 (1977-12-01), Burns
patent: 4064622 (1977-12-01), Morris et al.
patent: 4081600 (1978-03-01), Kueneman et al.
patent: 4095866 (1978-06-01), Merill
patent: 4241436 (1980-12-01), Bolzt et al.
patent: 4268956 (1981-05-01), Parks et al.
patent: 4287014 (1981-09-01), Gaku et al.
patent: 4296457 (1981-10-01), Hahlganss
patent: 4316320 (1982-02-01), Nogawa et al.
patent: 4331740 (1982-05-01), Burns
patent: 4338149 (1982-07-01), Quaschner
patent: 4343083 (1982-08-01), Takemura et al.
patent: 4355463 (1982-10-01), Burns
patent: 4402131 (1983-09-01), Roberts
patent: 4420364 (1983-12-01), Nukii et al.
patent: 4495546 (1985-01-01), Nakamura et al.
patent: 4509095 (1985-04-01), Boros
patent: 4532575 (1985-07-01), Suwa
patent: 4533787 (1985-08-01), Anderegg et al.
patent: 4550357 (1985-10-01), Matsumoto
patent: 4626462 (1986-12-01), Kober et al.
patent: 4664962 (1987-05-01), DesMarais, Jr.
patent: 4668332 (1987-05-01), Ohnuki et al.
patent: 4677529 (1987-06-01), Watanabe et al.
patent: 4687695 (1987-08-01), Hamby
patent: 4710854 (1987-12-01), Yamada et al.
patent: 4715928 (1987-12-01), Hamby
patent: 4756940 (1988-07-01), Payne et al.
patent: 4800461 (1989-01-01), Dixon et al.
Ardito et al., Making Integral Multilayer Circuit Boards with Cable Connection, IBM Tech. Bull., V. 14, #3, Aug. 1971, pp. 701 and 702.
Kapton.RTM. Polyimide Film: Summary of Properties (Du Pont Company, Wilmington, Del., 1983).

Affiliated with

Also associated with

Rating

Printed circuit and fabrication of same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit and fabrication of same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit and fabrication of same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1480695