Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Groove
Reexamination Certificate
2011-03-08
2011-03-08
Landau, Matthew C (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
Groove
C257S623000, C257S624000, C257S625000, C257S626000
Reexamination Certificate
active
07902639
ABSTRACT:
Improved methods and articles providing conformal coatings for a variety of devices including electronic, semiconductor, and liquid crystal display devices. Peptide formulations which bind to nanoparticles and substrates, including substrates with trenches and vias, to provide conformal coverage as a seed layer. The seed layer can be further enhanced with use of metallic films deposited on the seed layer. Seed layers can be characterized by AFM measurements and improved seed layers provide for better enhancement layers including lower resistivity in the enhancement layer. Peptides can be identified by phage display.
REFERENCES:
patent: 5695810 (1997-12-01), Dubin et al.
patent: 5830805 (1998-11-01), Shacham-Diamand et al.
patent: 5891513 (1999-04-01), Dubin et al.
patent: 6174812 (2001-01-01), Hsiung et al.
patent: 6207392 (2001-03-01), Weiss et al.
patent: 6235540 (2001-05-01), Siiman et al.
patent: 6277740 (2001-08-01), Goldstein
patent: 6417340 (2002-07-01), Mirkin et al.
patent: 6504227 (2003-01-01), Matsuo et al.
patent: 6605424 (2003-08-01), Lefkowitz et al.
patent: 6638564 (2003-10-01), Segawa et al.
patent: 6646345 (2003-11-01), Sambucetti et al.
patent: 6723600 (2004-04-01), Wong et al.
patent: 6774036 (2004-08-01), Goldstein
patent: 6780765 (2004-08-01), Goldstein
patent: 6797312 (2004-09-01), Kong et al.
patent: 6805904 (2004-10-01), Anders et al.
patent: 6821324 (2004-11-01), Shacham-Diamand et al.
patent: 6887297 (2005-05-01), Winter et al.
patent: 6887776 (2005-05-01), Shang et al.
patent: 6897151 (2005-05-01), Winter et al.
patent: 6902605 (2005-06-01), Kolics et al.
patent: 6927113 (2005-08-01), Sahota et al.
patent: 7005752 (2006-02-01), Bojkov et al.
patent: 7084060 (2006-08-01), Furukawa et al.
patent: 7410899 (2008-08-01), Chen et al.
patent: 2002/0006468 (2002-01-01), Paranjpe et al.
patent: 2002/0006723 (2002-01-01), Goldstein
patent: 2002/0019123 (2002-02-01), Ma et al.
patent: 2002/0153551 (2002-10-01), Wong et al.
patent: 2003/0042609 (2003-03-01), Choi
patent: 2003/0068900 (2003-04-01), Belcher et al.
patent: 2003/0073104 (2003-04-01), Belcher et al.
patent: 2003/0113714 (2003-06-01), Belcher et al.
patent: 2003/0136813 (2003-07-01), Magerlein et al.
patent: 2003/0148380 (2003-08-01), Belcher
patent: 2004/0127640 (2004-07-01), Belcher et al.
patent: 2004/0171139 (2004-09-01), Belcher et al.
patent: 2004/0207093 (2004-10-01), Sun et al.
patent: 2004/0238214 (2004-12-01), Liu
patent: 2004/0246692 (2004-12-01), Satoh et al.
patent: 2005/0014317 (2005-01-01), Pyo
patent: 2005/0064508 (2005-03-01), Belcher et al.
patent: 2005/0074968 (2005-04-01), Chen et al.
patent: 2005/0136193 (2005-06-01), Weidman et al.
patent: 2005/0153547 (2005-07-01), Barns
patent: 2005/0170336 (2005-08-01), Belcher et al.
patent: 2005/0180992 (2005-08-01), Belcher et al.
patent: 2005/0208754 (2005-09-01), Kostamo et al.
patent: 2005/0221083 (2005-10-01), Belcher et al.
patent: 2005/0245059 (2005-11-01), Yuan et al.
patent: 2005/0266698 (2005-12-01), Cooney, III et al.
patent: 2006/0003387 (2006-01-01), Peelle et al.
patent: 2006/0083850 (2006-04-01), Valverde et al.
patent: 2006/0084251 (2006-04-01), Nakagawa et al.
patent: 2006/0211236 (2006-09-01), Bureau et al.
patent: 2006/0254503 (2006-11-01), Dai et al.
patent: 2006/0280860 (2006-12-01), Paneccasio, Jr. et al.
patent: 2008/0067679 (2008-03-01), Takagi et al.
patent: 2008/0254205 (2008-10-01), Petrov et al.
Bindra, P. et al., “Chapter 12 Fundamental Aspects of Electroless Copper Plating”, American Electroplaters and Surface Finishers Society, 1990, pp. 289-329.
Jagannathan, R. et al., “Electroless plating of copper at a low pH level”, IBM J. Res. Develop., vol. 37, No. 2, Mar. 2, 1993, pp. 117-123.
Brown, S., “Metal-recognition by repeating polypeptides”, Nature Biotechnology, vol. 15, Mar. 1997, pp. 269-272.
U.S. Appl. No. 60/571,532, filed Apr. 17, 2004, Evelyn Hu.
Wong, S. et al., “Barrier/Seed Layer Requirements for Copper Interconnects”, 1998 International Interconnect Technology Conference (San Francisco, CA), Jun. 3, 1998, pp. 1-3.
Ryu, C. et al., “Electromigration of Submicron Damascene Copper Interconnects”, 1998 Symposium on VLSI Technology, Jun. 8-11, 1998, 2 pages.
Kohn, A. et al., “Evaluation of electroless deposited Co(W,P) thin films as diffusion barriers for copper metallization”, Microelectronic Engineering, vol. 55, Nos. 1-4, Mar. 2001, pp. 297-303.
Smekalin, K. et al., “Tuning the process flow to optimize copper CMP”, Solid State Technology, Sep. 2001, pp. 107, 108, 110 & 112.
Kohn, A. et al., “Characterization of electroless deposited Co(W , P) thin films for encapsulation of copper metallization”, Materials Science & Engineering, A303 (2001), pp. 18-25.
Naik, R. R. et al., “Silica-Precipitating Peptides Isolated from a Combinatorial Phage Display Peptide Library”, Journal of Nanoscience and Nanotechnology, V. 2, No. 1, Feb. 2002, pp. 95-100.
Kato, M. et al., “Substrate (Ni)-Catalyzed Electroless Gold Deposition from a Noncyanide Bath Containing Thiosulfate and Sulfite”, Journal of the Electrochemical Society, vol. 149, No. 3, Mar. 2002, pp. C164-C167.
Naik, R. R. et al., “Biomimetic synthesis and patterning of silver nanoparticles”, Nature Publishing Group, 2002, pp. 169-172.
Kohn, A. et al., “Improved diffusion barriers for copper metallization obtained by passivation of grain boundaries in electroless deposited cobalt-based films”, Journal of Applied Physics, vol. 92, No. 9, Nov. 1, 2002, pp. 5508-5511.
Healey, J., “Current Technical Trends: Dual Damascene & Low-k Dielectrics”, Threshold Systems, 2002, pp. 1-6.
Madou, M. J., “Metal Deposition”, Fundamentals of Microfabrication, 2002, pp. 344-357.
Nagel, D. J., “Chapter 18 Technologies for Micrometer and Nanometer Pattern and Material Transfer”, Direct-Write Technologies for Rapid Prototyping Applications: Sensors, Electronics, and Integrated Power Sources, Academic Press, 2002 pp. 557-701.
Mao, C. et al., “Viral assembly of oriented quantum dot nanowires”, PNAS, vol. 100, No. 12, Jun. 10, 2003, pp. 6946-6951.
Flynn, C. E. et al., “Synthesis and organization of nanoscale II-VI semiconductor materials using evolved peptide specificity and viral capsid assembly”, Journal of Materials Chemistry, Aug. 27, 2003, pp. 2414-2421.
Pinto, N.J. et al., “Electroless Deposition of Thin Metallic Films on Polymer Fibers Prepared Via Electrospinning”, Polymer Preprints, vol. 44, No. 2, Sep. 2003, pp. 138-139.
Banerjee, I. A. et al., “Cu nanocrystal growth on peptide nanotubes by biomeralization: Size control of Cu nanocrystals by tuning peptide conformation”, PNAS, vol. 100, No. 25, Dec. 9, 2003, pp. 14678-14682.
Mao, C. et al., “Virus-Based Toolkit for the Directed Synthesis of Magnetic and Semiconducting Nanowires”, Fundamentals of Microfabrication the Science of Miniaturization, Second Edition, vol. 303, Jan. 9, 2004, pp. 213-217.
Levy, R. et al., “Rational and Combinational Design of Peptide Capping Ligands for Gold Nanoparticles”, J. Am. Chem. Soc. 2004, 126, pp. 10076-10084.
Reiss, B. D. et al., “Biological Routes to Metal Alloy Ferromagnetic Nanostructures”, American Chemical Society, Nano Letters, 2004, vol. 4, No. 6, published on Web Apr. 30, 2004, pp. 1127-1132.
Narasimhan, M., “Inline Process Control of Advanced Thin Films at 65 nm and Beyond”, www.kla-tencor.com/magazine, Summer 2004, pp. 1-16.
Hu, C.-K. et al., “Effects of Overlayers on Electromigration Reliability Improvement for Cu/Low K Interconnects”, IEEE 42ndAnnual International Reliability Physics Symposium, Phoenix, 2004, pp. 222-228.
Okinaka, Y. “Chapter 15 Electroless Plating of Gold and Gold Alloys”, pp. 401-420.
Garrou Philip E.
Knapp Michael R.
Pakbaz Hash
Pschenitzka Florian
Quan Xina
Landau Matthew C
Mitchell James M
Seed IP Law Group PLLC
Siluria Technologies, Inc.
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