Prevention of electrostatic wafer sticking in plasma...

Details Prevention of electrostatic wafer sticking in plasma... Prevention of electrostatic wafer sticking in plasma...

2006-04-18

2006-04-18

Everhart, Caridad M. (Department: 2891)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

C438S729000

Reexamination Certificate

active

07030035

ABSTRACT:
To remove unwanted electrostatic charge from a substrate or substrate clamping mechanism in a plasma processing chamber following the plasma processing of the substrate, the process of shutting down the RF power supply is altered. Specifically, the present invention is a stepped RF power shut down sequence in which the RF power is lowered in a first step from full power to approximately 5 to 10 watts for a short period of time, such as approximately 1 second, and thereafter the RF power is turned off. As a result of this RF power shut down sequence, with its intermediate step, the plasma during the intermediate step acts to neutralize or discharge the electrostatic charge that has built up upon the wafer and/or clamping mechanism during full power operation. When the electrostatic charge has been removed, the wafer sticking problem is resolved.

REFERENCES:
patent: 4786814 (1988-11-01), Kolondra et al.
patent: 5612850 (1997-03-01), Birang et al.
patent: 6125025 (2000-09-01), Howald et al.
patent: 6333246 (2001-12-01), Narita et al.
patent: 2002/0078891 (2002-06-01), Chu et al.
patent: 2002/0124867 (2002-09-01), Kim et al.
patent: 2003/0073278 (2003-04-01), Ohmi et al.
patent: 2002323513 (2002-11-01), None

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