Pressure sensor

Details Pressure sensor Pressure sensor

2007-02-13

2007-02-13

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S414000, C257S415000, C257S417000, C257S418000, C257SE29324, C073S700000, C073S715000

Reexamination Certificate

active

11137404

ABSTRACT:
A pressure sensor chip includes a diaphragm and pads. A flexible printed circuit board (FPC) includes a resin sheet having a through-hole and wiring patterns that are formed within the resin sheet and sealed. The resin sheet is press-fitted to the pressure sensor chip such that the diaphragm is bared at the through-hole. The wiring patterns are connected to the pads, and junctions between the wiring patterns and the pads are sealed with the resin sheet.

REFERENCES:
patent: 4732042 (1988-03-01), Adams
patent: 5116331 (1992-05-01), Chapman
patent: 6346742 (2002-02-01), Bryzek et al.
patent: 6393922 (2002-05-01), Winterer
patent: A-10-153508 (1998-06-01), None
patent: A-2001-343298 (2001-12-01), None
Search Report from French Patent Office issued on Jul. 7, 2006 for the corresponding French patent application No. FR 0505574 (a copy thereof).

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