Metal working – Barrier layer or semiconductor device making
Patent
1991-07-19
1993-01-12
Chaudhuri, Olik
Metal working
Barrier layer or semiconductor device making
118 501, H01L 2168
Patent
active
051786389
ABSTRACT:
The pressure-reduced chamber system of the invention includes a handling mechanism for loading and/or unloading a semiconductor wafer between a process chamber in which a plasma etching is carried out on a semiconductor wafer under a reduced pressure, and a pressure-reduced chamber. Further, the system includes an outer cover for covering the driving force transmitting section of the handling mechanism, a filter mounted to the outer cover such that it defines the inside and outside of the outer cover, and an exhaustion pump for evacuating the space region formed between the outer cover and the pressure-reduced chamber. Thus, when the space region is evacuated by the exhaustion pump, the dust generated from the driving force transmitting section of the handling mechanism is caught by the filter.
REFERENCES:
patent: 4500407 (1985-02-01), Boys et al.
patent: 5080549 (1992-01-01), Goodwin et al.
Fugita Taichi
Kaneko Satoshi
Okumura Katsuya
Yoshida Yukimasa
Chaudhuri Olik
Graybill David E.
Kabushiki Kaisha Toshiba
Tokyo Electron Limited
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