Food or edible material: processes – compositions – and products – Products per se – or processes of preparing or treating... – Protein – amino acid – or yeast containing
Reexamination Certificate
2007-05-29
2007-05-29
Weier, Anthony (Department: 1761)
Food or edible material: processes, compositions, and products
Products per se, or processes of preparing or treating...
Protein, amino acid, or yeast containing
C426S512000
Reexamination Certificate
active
10318950
ABSTRACT:
Novel, edible, pressure molded proteinaceous wafer, waffle, inclusion ingredient, and cookie food products are derived utilizing an engineered batter formulation of proteinaceous materials, water, oils/fats, flavors, and select percentages of carbohydrates. The batter has a specific mass balance ratio that allows the wafers to be consistently manufactured on process equipment that was designed for carbohydrate wafer, waffle, or cookie processing. The novel engineered mass balance-based protein formulation provides a batter that can be pumped, utilizes standard steam port pressure relief systems, and results in a final food product that has marketable organoleptic qualities as a component in fabricated protein bars/snacks, confections, as an inclusion in other foods, or as an independent snack food, frozen breakfast food, cookie, or cone product.
REFERENCES:
patent: 2101633 (1937-12-01), Whitaker et al.
patent: 2801173 (1957-07-01), Devareaux
patent: 3185574 (1965-05-01), Gabby et al.
patent: 3431112 (1969-03-01), Durst
patent: 3446623 (1969-05-01), Cohan et al.
patent: 3814819 (1974-06-01), Morgan
patent: 3962462 (1976-06-01), Burkwall et al.
patent: 4068007 (1978-01-01), Forkner
patent: 4076846 (1978-02-01), Nakatsuka et al.
patent: 4543262 (1985-09-01), Michnowski
patent: 4735808 (1988-04-01), Scaglione et al.
patent: 4832971 (1989-05-01), Michnowski
patent: 4849230 (1989-07-01), Varvello
patent: 4859475 (1989-08-01), Michnowski
Archer Daniels Midland Company
Nilles Andrew F.
Weier Anthony
LandOfFree
Pressure molded proteinaceous wafers, ingredient inclusions,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Pressure molded proteinaceous wafers, ingredient inclusions,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pressure molded proteinaceous wafers, ingredient inclusions,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3752910