Pressure control method and processing device

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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Reexamination Certificate

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07553773

ABSTRACT:
First and second pressure sensors132and134that perform pressure detection over different pressure detection ranges from each other detect the pressure within a process chamber102of an etching device100. A pressure controller144selects optimal pressure data in correspondence to the pressure inside the process chamber from the pressure data provided by the first and second pressure sensors132and134. It also analyzes the selected pressure data at a resolution selected in correspondence to the pressure inside the process chamber102and thus obtains pressure data achieving a predetermined data density. The pressure controller134controls a pressure control valve130so as to ensure that the pressure data match preset pressure data.

REFERENCES:
patent: 5583297 (1996-12-01), Stocker et al.
patent: 6022483 (2000-02-01), Aral
patent: 6406545 (2002-06-01), Shoda et al.
patent: 6635580 (2003-10-01), Yang et al.
patent: 58-109811 (1983-06-01), None
patent: 02-148836 (1990-06-01), None
patent: 05-102088 (1993-04-01), None
patent: 05-267224 (1993-10-01), None
patent: 08-227879 (1996-09-01), None
English Translation of International Preliminary Examination Report, Feb. 7, 2002.

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