Specialized metallurgical processes – compositions for use therei – Compositions – Consolidated metal powder compositions
Patent
1982-06-24
1985-04-02
Padgett, Ben R.
Specialized metallurgical processes, compositions for use therei
Compositions
Consolidated metal powder compositions
419 65, 419 66, 29596, B22F 100
Patent
active
045085676
ABSTRACT:
A flux-path forming member of a motor is prepared from a mixture mass by evenly mixing up to 4% of a thermosetting resin binder and molybdenum disulfide with at least 96% of a metal powder, fibrous metal, or a combination thereof; a second step of compacting in a mold under pressure the mixture mass into a desired shape; and a third step of heating, concurrently with or subsequently to the second step, the mixture mass to an elevated temperature to cure the binder portion thereof. The compact prepared by the above process is also disclosed. The content of the thermosetting resin at least 0.2 percent by weight, and the content of the molybdenum disulfide is at least 0.1 percent by weight. The curing operation is conducted at a temperature not higher than 300.degree. C.
REFERENCES:
patent: 3463047 (1969-08-01), Germershausen
patent: 3732617 (1973-05-01), Rowe et al.
patent: 4104176 (1978-08-01), Bidler
patent: 4242398 (1980-12-01), Segawa et al.
patent: 4246316 (1981-01-01), Aonuma et al.
Hausner, Handbook of Powder Metallurgy, Chemical Publishing Co., N.Y. (1973), p. 132, TN695,H36h.
Condensed Chemical Dictionary Van Nostrand, N.Y. 1977, pp. 86 and 856, QD5C5.
Katsu Masutaro
Mizuno Haruki
Mizuno Shigeru
Suzuki Masahiko
Brother Kogyo Kabushiki Kaisha
Padgett Ben R.
LandOfFree
Press-molding process for preparing a powder compact does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Press-molding process for preparing a powder compact, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Press-molding process for preparing a powder compact will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1089681