Prepreg, and a fiber reinforced composite material

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428323, 428327, 428413, 4284735, 4284744, 4284747, 428480, 428524, B32B 2704, B32B 516, B32B 2738

Patent

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059854316

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to a prepreg used for forming a fiber reinforced composite material, and a fiber reinforced composite material produced by forming the prepreg. In more detail, the present invention relates to a prepreg used for forming a fiber reinforced material excellent in compressive mechanical properties and suitable as a structural material, and a fiber reinforced composite material produced by forming the prepreg.


BACKGROUND ART

Polymer based composite materials consisting of reinforcing fibers and a matrix resin are widely used for sporting goods, aerospace, general industries, etc. Fiber reinforced composite materials are produced by various methods, and among the methods, it is widely practiced to use intermediate sheets, in which reinforcing fibers are impregnated with an unhardened matrix resin, as a prepreg. In this method, usually, sheets of a prepreg are laminated and heated, to form a composite material. The matrix resins used for prepregs include both thermosetting resins and thermoplastic resins, and in most cases, thermosetting resins excellent in handling convenience are used. Above all, epoxy resins are used most frequently. Furthermore, maleimide resins, cyanate resins, and their combinations are also often used.
In general, polymer based materials decline in strength and elastic modulus at high temperature and/or high humidity. Therefore, fiber reinforced composite materials using a polymer as a matrix are also likely to decline in physical properties such as strength at high temperature or high humidity. However, the composite materials used as structural materials of airplanes, vehicles, ships, etc. are required to keep physical properties sufficiently even at high temperature and/or high humidity. When a fiber reinforced composite material is used as a structural material, compressive strength is an especially important physical property. The compressive strength can be measured by using a unnotched coupon, notched coupon or cylinder, etc. as a test piece, but in actual use, since the fiber reinforced composite material is often used as a plate with bolt holes, the compressive strength of a notched coupon especially at high temperature and at high humidity is important.
However, conventional polymer based composite materials are not always sufficient in the compressive strength at high temperature or high humidity even though they are advantageously light in weight. So, they are sometimes limited in applicability. To enhance the compressive strength at high temperature and high humidity, it is effective to enhance the elastic modulus of the resin, and it is considered important to prevent the decline of elastic modulus at high temperature and high humidity. For enhancing the elastic modulus of the resin, it has been proposed to use epoxy resins higher in crosslinking density, and for preventing the decline of elastic modulus at high temperature and high humidity, it has been proposed to decrease the percentage of water absorption and to introduce a heat resistant skeleton. As resin compositions for prepregs balanced in impact resistance, heat resistance and water resistance, Japanese Patent Laid-Open Nos. 62-297316 and 62-297312 disclose resin compositions consisting of an epoxy resin composition mainly composed of an epoxy resin with triglycidylaminophenol skeleton, and diaminodiphenylsulfone (DDS), polyether sulfone (PES) or polyether imide (PEI).
However, their heat resistance is evaluated in reference to glass transition temperature, and water resistance, to the percentage of water absorption, respectively separately, and the problem that an epoxy resin with triglycidylaminophenol skeleton declines greatly in physical properties at high temperature and high humidity is not solved at all. Furthermore, to prevent the decline of hardened epoxy resins in physical properties caused by moisture absorption, less hygroscopic diamine hardening agents and their epoxy resin compositions are disclosed in Japanese Patent Laid-Open Nos. 59-215314, 59-215315

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