Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1985-03-27
1986-07-01
Lee, Lester L.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430285, 430286, 430287, 430288, 430296, 430303, 430306, 430906, 430908, G03C 170
Patent
active
045980381
ABSTRACT:
Highly heat resistant polyimide and polyisoindoloquinazoline dione relief structures can be produced by applying radiation-sensitive soluble polymer precursors in the form of a film or foil on a substrate, irradiating the film or foil through negative patterns with actinic light or electrons or a light, electron, ion or laser beam, removing the unirradiated film or foil portions and optionally by subsequent annealing. The relief structures are produced in an inexpensive manner with high purity and in a chloride-free form as well as having economically acceptable exposure times as a result of using as polymer precursors poly-condensation products which are prepared in the presence of carbodiimides. The polycondensation products are prepared from diamino compounds or diamino compounds having at least one orthopositioned amido group and olefinically unsaturated tetracarboxylic acid diesters of aromatic and/or heterocyclic tetracarboxylic acid dianhydrides and olefinically unsaturated alcohols. The relief structures produced by the method according to the invention are suitable in particular for use as resist, surface protection, and because of the high purity as durable protective and insulating material in the semiconductor field.
REFERENCES:
patent: 3957512 (1976-05-01), Kleeberg et al.
patent: 3957712 (1976-05-01), Heyden et al.
patent: 4311785 (1982-01-01), Ahne et al.
Lee Lester L.
Siemens Aktiengesellschaft
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