Preferential etching of a piezoelectric material

Details Preferential etching of a piezoelectric material Preferential etching of a piezoelectric material

1985-09-09

1987-04-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156647, 156649, 156654, 156663, 219121LJ, 219121LM, B44C 122, C03C 1500, C03C 2506

Patent

active

046612017

ABSTRACT:
A method for preferentially etching a piezoelectric material is disclosed wherein a portion of the piezoelectric material is controllably subjected to a concentrated thermal energy source with a force sufficient to alter the crystalline orientation of the piezoelectric material. The piezoelectric material is then treated with a suitable echant for a controlled duration, wherein the portion of the piezoelectric material altered by the concentrated thermal energy source is etched at a different etching rate than the unaltered piezoelectric material, to preferentially etch a controlled anaglyphic planar configuration upon the piezoelectric material.

REFERENCES:
patent: 3626141 (1971-12-01), Daly
patent: 3814895 (1974-06-01), Fredriksen
patent: 3816700 (1974-06-01), Weiner et al.
patent: 3991296 (1979-11-01), Kojima et al.
patent: 4046985 (1977-09-01), Gates
patent: 4141456 (1979-02-01), Hart
patent: 4182024 (1980-01-01), Cometta
patent: 4450041 (1984-05-01), Akufi
Laser-Induced Twinning in Quartz, by T. L. Anderson et al., Materials Research Laboratory, Pennsylvania State University, 1976.

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