Precursor compositions and processes for MOCVD of barrier...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

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C438S794000, C257SE21493, C257SE23167, C427S255180, C556S400000

Reexamination Certificate

active

10643110

ABSTRACT:
Metalorganic precursors of the formula:in-line-formulae description="In-line Formulae" end="lead"?(R1R2N)a−bMXbin-line-formulae description="In-line Formulae" end="tail"?wherein: M is the precursor metal center, selected from the group of Ta, Ti, W, Nb, Si, Al and B; a is a number equal to the valence of M; 1≦b≦(a−1); R1and R2can be the same as or different from one another, and are each independently selected from the group of H, C1–C4alkyl, C3–C6cycloalkyl, and R03Si, where each R0can be the same or different and each R0is independently selected from H and C1–C4alkyl; and X is selected from the group of chlorine, fluorine, bromine and iodine. Precursors of such formula are useful for chemical vapor deposition (MOCVD) of conductive barrier materials in the manufacture of microelectronic device structures, e.g., by atomic layer chemical vapor deposition on a substrate bearing nitrogen-containing surface functionality. Further described is a method of forming Si3N4on a substrate at low temperature, e.g., using atomic layer chemical vapor deposition (ALCVD).

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