Preconditioner for a polishing pad and method for using the same

Details Preconditioner for a polishing pad and method for using the same Preconditioner for a polishing pad and method for using the same

1995-01-30

1996-06-18

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 1566451, 216 90, 451444, H01L 21302, B24B 100

Patent

active

055274242

ABSTRACT:
A preconditioning plate (10) prepares the surface of a polishing pad (24) to prepare the pad's surface for subsequent metal polishing of semiconductor wafers (27). The preconditioning plate has at least three intersecting radial ridges (14) on its surface and is made from a rigid plastic material. The preconditioning plate is rotated relative to the surface of the polishing pad prior to actual polishing to provide a uniform and stable polishing surface. The preconditioning plate does not abrade or wear away the polishing pad, nor does it form grooves in the polishing pad. Additionally, the preconditioning plate is reusable.

REFERENCES:
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5456627 (1995-10-01), Jackson et al.

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