Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2006-12-01
2010-06-15
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C438S049000, C438S052000, C438S055000, C438S057000, C257SE21101, C257SE21122, C257SE21131, C257SE21134, C257SE21175, C257SE25007, C257SE31033, C257SE31039, C257SE31126, C257SE33008, C117S089000, C117S092000, C117S093000, C117S097000
Reexamination Certificate
active
07736928
ABSTRACT:
Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper. Embodiments of the invention may provide an apparatus and method of forming a solar cell device that utilizes a reusable masking device during one or more electrochemical deposition steps.
REFERENCES:
patent: 3849880 (1974-11-01), Haynos
patent: 4240880 (1980-12-01), Tsuchibuchi et al.
patent: 4436558 (1984-03-01), Russak
patent: 4581108 (1986-04-01), Kapur et al.
patent: 4617420 (1986-10-01), Dilts et al.
patent: 4623751 (1986-11-01), Kishi et al.
patent: 4666567 (1987-05-01), Loch
patent: 4789437 (1988-12-01), Sing et al.
patent: 4869971 (1989-09-01), Nee et al.
patent: 5057163 (1991-10-01), Barnett et al.
patent: 5198965 (1993-03-01), Curtis et al.
patent: 5209817 (1993-05-01), Ahmad et al.
patent: 5277786 (1994-01-01), Kawakami
patent: 5575855 (1996-11-01), Kanai et al.
patent: 5588994 (1996-12-01), Bozler et al.
patent: 5841197 (1998-11-01), Adamic et al.
patent: 5897368 (1999-04-01), Cole, Jr. et al.
patent: 5968333 (1999-10-01), Nogami et al.
patent: 5972192 (1999-10-01), Dubin et al.
patent: 6103085 (2000-08-01), Woo et al.
patent: 6197181 (2001-03-01), Chen
patent: 6261433 (2001-07-01), Landau
patent: 6294822 (2001-09-01), Nakata
patent: 6297155 (2001-10-01), Simpson et al.
patent: 6299745 (2001-10-01), Kumar et al.
patent: 6391166 (2002-05-01), Wang
patent: 6406610 (2002-06-01), Lowe
patent: 6447938 (2002-09-01), Bianchi
patent: 6559479 (2003-05-01), Ludemann
patent: 6572742 (2003-06-01), Cohen
patent: 6610189 (2003-08-01), Wang et al.
patent: 6670543 (2003-12-01), Lohmeyer et al.
patent: 6706166 (2004-03-01), Chou et al.
patent: 6881318 (2005-04-01), Hey et al.
patent: 7172184 (2007-02-01), Pavani et al.
patent: 7339110 (2008-03-01), Mulligan et al.
patent: 7388147 (2008-06-01), Mulligan et al.
patent: 2003/0192583 (2003-10-01), Ryan
patent: 2003/0230337 (2003-12-01), Gaudiana et al.
patent: 2004/0067324 (2004-04-01), Lazarev et al.
patent: 2004/0074762 (2004-04-01), Keigler et al.
patent: 2004/0118446 (2004-06-01), Toyomura
patent: 2004/0198187 (2004-10-01), Tolles
patent: 2004/0200520 (2004-10-01), Mulligan et al.
patent: 2005/0061665 (2005-03-01), Pavani et al.
patent: 2005/0103377 (2005-05-01), Saneyuki et al.
patent: 2005/0121326 (2005-06-01), Klocke et al.
patent: 2005/0199489 (2005-09-01), Stevens et al.
patent: 2005/0272263 (2005-12-01), Brabec et al.
patent: 2006/0033678 (2006-02-01), Lubomirsky et al.
patent: 2006/0062897 (2006-03-01), Gu et al.
patent: 2006/0174935 (2006-08-01), Sawada et al.
patent: 2006/0185714 (2006-08-01), Nam et al.
patent: 2006/0185716 (2006-08-01), Murozono et al.
patent: 2006/0207885 (2006-09-01), Basol
patent: 2006/0217049 (2006-09-01), Li et al.
patent: 2006/0219565 (2006-10-01), Preusse et al.
patent: 2006/0223300 (2006-10-01), Simka et al.
patent: 2008/0092947 (2008-04-01), Lopatin et al.
patent: 2008/0121276 (2008-05-01), Lopatin et al.
patent: 2008/0128013 (2008-06-01), Lopatin et al.
patent: 2008/0128019 (2008-06-01), Lopatin et al.
patent: 2008/0128268 (2008-06-01), Lopatin et al.
International Search Report, May 8, 2008.
Popov, et al., “The Relationship Between the Effective Current Density and the Effective Overpotential in Copper Deposition by the Pulsating Potential”, Institute of Chemistry, Technology and Metallurgy, Beograd, Yugoslavia, Journal of Applied Electrochemistry 4 (1974), pp. 267-273.
Puippe, et al., “The Morphology of Pulse-Plated Deposits”, Plating and Surface Finishing, Jun. 1980, pp. 68-72, (Based on a presentation made at the AES International Symposium on Pulse Plating, Apr. 19-20, 1979).
Kray, et al “High-Efficiency Emitter-Wrap-Through Cells”, 17th EU-PVSEC Munich (2001), Paper 0A8.1, pp. 1-4.
Eager, et al. “Environmentally Friendly Processes in the Manufacture of Saturn Solar Cells”, 2002 IEEE, pp. 62-65.
Domeier, et al. “Microscreen-based Replication of Electroforming Micromolds”, Microsystem Technologies 8 (2002), pp. 78-82.
Fredenberg, et al. “Recent Progress in the Development of ECPR (ElectroChemical Pattern Replication) Metal Printing for Microelectronics”, 208th ECS Meeting, Oct. 16-21, 2005, Los Angeles, California, Abstract #682.
Weeber, et al. “How to Achieve 17% Cell Efficiencies on Large Back-Contacted Mc-Si Solar Cells”, 2006 IEEE 4th World Conference on Photovoltaic Energy Conversion, May 7-12, 2006, Hawaii, pp. 1-4.
Granek, et al. “A Systematic Approach to Reduce Process-Induced Shunts in Back-Contacted Mc-Si Solar Cells”, 2006 IEEEE 4th World Conference on Photovoltaic Energy Conversion, May 7-12, 2006 Hawaii, pp. 1-4.
Lee, et al. “Correlation of Stress and Texture Evolution During Self-and Thermal Annealing of Electroplated Cu Films”, 2000 IEEE, pp. 114-116.
Lee, et al. “Evidence of Dislocation Loops as a Driving Force for Self-Annealing in Electroplated Cu Films”, 2001 IEEE, pp. 236-238.
Lopatin, et al. “Electroless Cu and Barrier Layers for Sub-Half Micron Multilevel Interconnects”, SPIE vol. 3214, pp. 21-32.
Eikelbloom, et al. “Conductive Adhesives for Low-Stress Interconnection of Thin Back-Contact Solar Cells”, 29th IEEE Photovoltaic Specialists Conference, May 20-24, 2002, New Orleans, pp. 1-4, http://www.ecn.nl/docs/library/report/2002/rx02052.pdf.
Schubert, et al. “Flexible Solar Cells for Clothing”, Materials Today, Jun. 2006, vol. 9 No. 6, pp. 42-50.
International Search Report. Sep. 19, 2008.
PCT International Search Report and Written Opinion dated Apr. 9, 2009, International Application No. PCT/US07/85959.
Prosecution History for U.S. Appl. No. 11/566,202.
Bachrach Robert
Busch John
Dukovic John O.
Eaglesham David
Gay Charles
Applied Materials Inc.
Lebentritt Michael S
Patterson & Sheridan
LandOfFree
Precision printing electroplating through plating mask on a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Precision printing electroplating through plating mask on a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Precision printing electroplating through plating mask on a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4231720