Precision marking of layers

Details Precision marking of layers Precision marking of layers

1983-11-17

1986-02-04

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29572, 156656, 1566591, 156904, 219121LH, 219121LM, 427 531, 430363, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

045684090

ABSTRACT:
Selective incision of metallic layers overlying semiconductors by laser ablation (evaporation) of selected regions of a dye sensitized coating on each such metallic layer, followed by etching of the metallic layer to avoid objectionable alloying by laser scribing of the metallic layer to provide the desired incisions.

REFERENCES:
patent: 4037075 (1977-07-01), Pugsley et al.
patent: 4259433 (1981-03-01), Mizobuchi et al.
patent: 4315096 (1982-02-01), Tyan et al.

Affiliated with

Also associated with

Rating

Precision marking of layers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Precision marking of layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Precision marking of layers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2338984