Precision high-frequency capacitor formed on semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S330000, C257SE23013, C257SE23144

Reexamination Certificate

active

08004063

ABSTRACT:
A precision high-frequency capacitor includes a dielectric layer formed on the front side surface of a semiconductor substrate and a first electrode on top of the dielectric layer. The semiconductor substrate is heavily doped and therefore has a low resistivity. A second electrode, insulated from the first electrode, is also formed over the front side surface. In one embodiment, the second electrode is connected by a metal-filled via to a layer of conductive material on the back side of the substrate. In alternative embodiments, the via is omitted and the second electrode is either in electrical contact with the substrate or is formed on top of the dielectric layer, yielding a pair of series-connected capacitors. ESD protection for the capacitor can be provided by a pair of oppositely-directed diodes formed in the substrate and connected in parallel with the capacitor. To increase the capacitance of the capacitor while maintaining a low effective series resistance, each of the electrodes may include a plurality of fingers, which are interdigitated with the fingers of the other electrode. The capacitor is preferably fabricated in a wafer-scale process concurrently with numerous other capacitors on the wafer, and the capacitors are then separated from each other by a conventional dicing technique.

REFERENCES:
patent: 3471756 (1969-10-01), McAffe et al.
patent: 4115795 (1978-09-01), Masuoka et al.
patent: 4246502 (1981-01-01), Kubinec
patent: 4432035 (1984-02-01), Hsieh et al.
patent: 4751562 (1988-06-01), Yamamura
patent: 4937660 (1990-06-01), Dietrich et al.
patent: 4980799 (1990-12-01), Tobita
patent: 5208726 (1993-05-01), Apel
patent: 5352913 (1994-10-01), Chung et al.
patent: 5360989 (1994-11-01), Endo
patent: 5414284 (1995-05-01), Baxter et al.
patent: 5539613 (1996-07-01), Yamamichi et al.
patent: 5706163 (1998-01-01), Kalb et al.
patent: 5808855 (1998-09-01), Chan et al.
patent: 5811868 (1998-09-01), Bertin et al.
patent: 5841182 (1998-11-01), Linn et al.
patent: 5879984 (1999-03-01), Shin et al.
patent: 5889299 (1999-03-01), Abe et al.
patent: 5965928 (1999-10-01), Nagura
patent: 5970321 (1999-10-01), Hively
patent: 6034392 (2000-03-01), Joo
patent: 6103585 (2000-08-01), Michaelis et al.
patent: 6225651 (2001-05-01), Billon
patent: 6278158 (2001-08-01), Pastor et al.
patent: 6303957 (2001-10-01), Ohwa
patent: 6359234 (2002-03-01), Kouda
patent: 6441424 (2002-08-01), Klose et al.
patent: 6538300 (2003-03-01), Goldberger et al.
patent: 6621143 (2003-09-01), Goldberger et al.
patent: 6621142 (2003-10-01), Goldberger et al.
patent: 7151036 (2006-12-01), Goldberger et al.
patent: 234384 (1987-09-01), None
patent: 0412514 (1991-02-01), None
patent: 887854 (1998-12-01), None
patent: 2060253 (1981-04-01), None
patent: 62-111443 (1987-05-01), None
patent: 5-29574 (1993-02-01), None
patent: 9-64275 (1997-03-01), None
patent: 9275189 (1997-10-01), None
patent: 10-093019 (1998-10-01), None
patent: 2003-133475 (2003-05-01), None
patent: 2101803 (1998-01-01), None
patent: WO98/43298 (1998-10-01), None
Slater, D.B., et al.; “Low Voltage Coefficient Capacitors for VLSI Processes” IEEE Journal of Solid-State Circuits, IEEE Inc. New York, US, vol. 24, No. 1, Feb. 1, 1989, pp. 163-173.
Patent Abstracts of Japan, vol. 2000, No. 8, Oct. 6, 2000, JP 2000 150810 A (Toshiba Corp.), May 30, 2000.
Patent Abstracts of Japan, vol. 1997, No. 01, Jan. 31, 1997, JP 08 236698 (A NEC Eng. Ltd) Sep. 13, 1996.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Precision high-frequency capacitor formed on semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Precision high-frequency capacitor formed on semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Precision high-frequency capacitor formed on semiconductor... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2656200

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.