Pre-process before cutting a wafer and method of cutting a...

Details Pre-process before cutting a wafer and method of cutting a... Pre-process before cutting a wafer and method of cutting a...

2007-05-01

2007-05-01

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S068000, C438S113000, C257SE21238, C257SE21008, C257S483000

Reexamination Certificate

active

10950909

ABSTRACT:
A pre-process before cutting a wafer is described. The wafer includes a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scribe lines close to the corner regions of the dies. Removing the material layer at the corner regions before cutting the wafer is able to preserve the integrity of the corner regions of the cut dies.

REFERENCES:
patent: 5024970 (1991-06-01), Mori
patent: 5096855 (1992-03-01), Vokoun, III
patent: 5459340 (1995-10-01), Anderson et al.
patent: 5530280 (1996-06-01), White
patent: 6214703 (2001-04-01), Chen et al.
patent: 6734544 (2004-05-01), Yan et al.
patent: 6821867 (2004-11-01), Matsuura et al.

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