Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent
1996-05-02
1999-03-23
Ortiz, Angela
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
26427217, 2643285, B29C 4514, B29C 7070
Patent
active
058855068
ABSTRACT:
A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.
REFERENCES:
patent: H1654 (1997-06-01), Rounds
patent: 2338607 (1944-01-01), Wacker
patent: 4513942 (1985-04-01), Creasman
patent: 5043199 (1991-08-01), Kubota et al.
patent: 5098626 (1992-03-01), Pas
patent: 5175007 (1992-12-01), Elliott
patent: 5431854 (1995-07-01), Pas
patent: 5556647 (1996-09-01), Abe et al.
Bolanos Mario A.
Chee Tay Liang
Libres Jeremias L.
Lim Julius
Pas Ireneus J. T. M.
Brady III W. James
Courtney Mark E.
Donaldson Richard L.
Ortiz Angela
Texas Instruments Incorporated
LandOfFree
Pre-packaged molding for component encapsulation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Pre-packaged molding for component encapsulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pre-packaged molding for component encapsulation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2122301