4. Plastic article or earthenware shaping or treating: apparatus
  5. Distinct means to feed, support or manipulate preform stock...
  6. Opposed registering coacting female molds

Mario A. Bolanos

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Dambarless leadframe for molded component encapsulation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Dambarless leadframe for molded component encapsulation

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent

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Mechanical interlocking of fillers and epoxy/resin

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Method for manufacturing prepackaged molding compound for compon

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface
Patent

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Method for manufacturing prepackaged molding compound for compon

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent

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Profile ID: LFUS-PAI-P-172659

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