Pre-molded clip structure

Details Pre-molded clip structure Pre-molded clip structure

2010-06-24

2010-11-23

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S112000, C438S127000, C257SE21505

Reexamination Certificate

active

07838340

ABSTRACT:
A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.

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