Pre-formed conductive bumps on bonding pads

Details Pre-formed conductive bumps on bonding pads Pre-formed conductive bumps on bonding pads

2008-08-26

2011-10-04

Wagner, Jenny L (Department: 2891)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S617000, C257SE23021

Reexamination Certificate

active

08030098

ABSTRACT:
Apparatuses including pre-forming conductive bumps on bonding pads for probing and wire-bonding connections and methods for making the same are disclosed. A method may include providing a microelectronic die including a conductive bump formed on a bonding pad, and an insulating layer formed on at least a portion of a surface of the conductive bump, and probing the conductive bump to test the microelectronic die. Other embodiments are also described.

REFERENCES:
patent: 7160797 (2007-01-01), Beatson
patent: 2002/0109216 (2002-08-01), Matsuzaki et al.
patent: 2003/0143797 (2003-07-01), Paik et al.

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