Power surface mount light emitting die package

Details Power surface mount light emitting die package Power surface mount light emitting die package

2007-07-17

2007-07-17

Lee, Eugene (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257S099000, C257S100000, C257S095000, C257S699000, C257S706000, C257S707000, C257S712000, C257SE33056

Reexamination Certificate

active

10692351

ABSTRACT:
A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate may be made from thermally conductive but electrically insulating material or from a material that is both thermally and electrically conductive. In embodiments wherein the substrate is made from an electrically conductive material, the substrate further includes an electrically insulating, thermally conductive material formed on the electrically conductive material. The substrate has traces for connecting to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad. The lens substantially covers the mounting pad. Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink). The reflector plate includes a reflective surface to direct light from the LED in a desired direction.

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U.S. Appl. No. 10/446,532, Entitled: Power surface mount light emitting die package, Inventor(s): Ban P. Loh, filing date: May 27, 2003, Published date: Mar. 4, 2004.
U.S. Appl. No. 10/721,654, Entitled: Composite leadframe LED package and method of making the same, Inventor(s): Ban P. Loh, filing date: Nov. 25, 2003, Published date: Jul. 1, 2004.
U.S. Appl. No. 10/721,641, Entitled: LED package die having a small footprint, Inventor(s): Ban P. Loh, filing date: Nov. 25, 2003, Published date: Jul. 1, 2004.
U.S. Appl. No. 10/861,929, Entitled: Power light emitting die package with reflecting lens and the method of making the same, Inventor(s): Ban P. Loh, Gerald H. Negley, filing date: Jun. 4, 2004, Published date: Not yet published.
U.S. Appl. No. 10/861,639, Entitled: Composite optical lens with an integrated reflector, Inventor(s): Ban P. Loh, Gerald H. Negley, filing date: Jun. 4, 2004, Published date: Not yet published.
International Search Report dated Feb. 27, 2007.

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