Power supply connection structure to a semiconductor device

Details Power supply connection structure to a semiconductor device Power supply connection structure to a semiconductor device

2006-06-06

2006-06-06

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S693000, C257S698000, C257S731000, C257S734000

Reexamination Certificate

active

07057272

ABSTRACT:
A package substrate has a power supply path different from a signal supply path to a semiconductor element. A semiconductor element is mounted on a first surface of the package substrate. A second surface opposite to the first surface is provided with external connection terminals. A power supply layer is formed inside the package substrate. The package substrate has electrode terminals provided in a part other than the second surface. The electrode terminals are connected to the power supply layer.

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