Power semiconductor module with pressure contact means

Details Power semiconductor module with pressure contact means Power semiconductor module with pressure contact means

2005-04-19

2005-04-19

Dinh, Phuong (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

06881071

ABSTRACT:
A power semiconductor module consists of a ceramic substrate with electrically conductive contact surfaces arranged thereon in a “circuit-friendly” manner. Components arranged on the substrate in a “circuit-friendly” manner. A pressure contact means, consisting of a flexible pressure accumulator, and a pressure plate produce pressure for resilient bonding of power and control connections. To increase performance, reliability and service life while reducing manufacturing costs, different configuration methods for the individual components are absolutely essential. This is achieved by a flexible circuit board which connects components with each other in a circuit-friendly manner and/or with the contact surfaces of the substrate, whereby a flexible insulation material is provided to insulate components from each other.

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patent: 4180828 (1979-12-01), Schermer et al.
patent: 4657322 (1987-04-01), Grellmann et al.
patent: 41 32 947 (1993-08-01), None
patent: 196 48 562 (1998-04-01), None
patent: 199 03 875 (2000-10-01), None

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