Power semiconductor module

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

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Details

257528, H01L 23495

Patent

active

061473960

ABSTRACT:
A power semiconductor module includes a lead frame, at least one power semiconductor component fastened on said lead frame, a housing at least partly encapsulating said power semiconductor component, a plurality of output lines electrically conductively connected to said power semiconductor component and including load current-carrying output lines, electrically conductive connections between said at least one power semiconductor component and at least said load current-carrying output lines, and an interrupter. The interrupter irreversibly interrupts at least said load current-carrying output lines and/or said electrically conductive connections and at least said load current-carrying output lines, if the temperature of said power semiconductor component exceeds a predetermined temperature threshold. The interrupter is formed of a material having a volume-expanding and/or an oxidizing and/or an explosive characteristic with an increasing temperature.

REFERENCES:
patent: 5068706 (1991-11-01), Sugita et al.
patent: 5543632 (1996-08-01), Ashley
patent: 5945728 (1999-08-01), Dobkin et al.
patent: 5998856 (1999-12-01), Noda et al.
patent: 6002166 (1999-12-01), Noda et al.

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