Power semiconductor heatsinking

Details Power semiconductor heatsinking Power semiconductor heatsinking

2009-05-14

2011-12-06

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080200, C165S080300, C165S185000, C257S719000, C361S704000, C361S720000

Reexamination Certificate

active

08072761

ABSTRACT:
A heatsink includes a thermally conductive body including a plurality of fins configured to conduct and dissipate heat. The body is configured to receive a circuit board containing heat-producing electrical components along a width of the body. The heatsink further includes a pivot mechanism pivotally coupled to the body and configured and disposed to contact the heat-producing electrical components. The heatsink further includes a bias device connected to the body and the pivot mechanism and configured to change from a first state to a second state to cause the pivot mechanism to rotate relative to the body to move a contact portion of the pivot mechanism toward the body. The heatsink is configured to receive the heat-producing electrical components between the contact portion of the pivot mechanism and the body, and the bias device is configured to bias the contact portion of the pivot mechanism to urge the heat-producing electrical components against the body when the bias device is in the second state.

REFERENCES:
patent: 4972294 (1990-11-01), Moses, Jr. et al.
patent: 5930112 (1999-07-01), Babinski et al.
patent: 6079486 (2000-06-01), Cennamo et al.
patent: 6219246 (2001-04-01), Edevold et al.
patent: 6252773 (2001-06-01), Werner
patent: 6418024 (2002-07-01), Edevold et al.
patent: 2001/0045779 (2001-11-01), Lee et al.
patent: 2004/0222517 (2004-11-01), Robertson et al.
patent: 2005/0013120 (2005-01-01), Liu
patent: 2005/0099779 (2005-05-01), Vackar
patent: 2005/0270750 (2005-12-01), Sarno et al.
patent: 2009/0257197 (2009-10-01), Yang et al.
patent: 19722602 (1998-12-01), None
patent: 2187886 (1987-09-01), None
patent: 2430310 (2007-03-01), None
International Search Report dated Aug. 19, 2010 from International Application No. PCT/US2010/034864, 3 pages.

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