Process of fabricating a semiconductor package

Details Process of fabricating a semiconductor package Process of fabricating a semiconductor package

2007-11-16

2011-11-22

Arbes, Carl (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S832000, C257S183000, C438S107000, C438S121000

Reexamination Certificate

active

08061023

ABSTRACT:
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.

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