Power semiconductor devices with mesa structures and buffer...

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Mesa or stacked emitter

Reexamination Certificate

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C438S039000, C438S041000, C438S496000, C438S571000, C438S586000, C257S170000, C257S542000, C257S466000, C257S618000, C257S623000, C257SE29185, C257SE29321, C257SE21377

Reexamination Certificate

active

07838377

ABSTRACT:
A bipolar junction transistor includes a collector having a first conductivity type, a drift layer having the first conductivity type on the collector, a base layer on the drift layer and having a second conductivity type opposite the first conductivity type, a lightly doped buffer layer having the first conductivity type on the base layer and forming a p-n junction with the base layer, and an emitter mesa having the first conductivity type on the buffer layer and having a sidewall. The buffer layer includes a mesa step adjacent to and spaced laterally apart from the sidewall of the emitter mesa, and a first thickness of the buffer layer beneath the emitter mesa is greater than a second thickness of the buffer layer outside the mesa step.

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