Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Mesa or stacked emitter
Reexamination Certificate
2008-09-09
2010-11-23
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
Mesa or stacked emitter
C438S039000, C438S041000, C438S496000, C438S571000, C438S586000, C257S170000, C257S542000, C257S466000, C257S618000, C257S623000, C257SE29185, C257SE29321, C257SE21377
Reexamination Certificate
active
07838377
ABSTRACT:
A bipolar junction transistor includes a collector having a first conductivity type, a drift layer having the first conductivity type on the collector, a base layer on the drift layer and having a second conductivity type opposite the first conductivity type, a lightly doped buffer layer having the first conductivity type on the base layer and forming a p-n junction with the base layer, and an emitter mesa having the first conductivity type on the buffer layer and having a sidewall. The buffer layer includes a mesa step adjacent to and spaced laterally apart from the sidewall of the emitter mesa, and a first thickness of the buffer layer beneath the emitter mesa is greater than a second thickness of the buffer layer outside the mesa step.
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Agarwal Anant K.
Zhang Qingchun
Abdelaziez Yasser A
Cree Inc.
Garber Charles D
Myers Bigel & Sibley & Sajovec
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