Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2006-11-21
2010-06-08
Jackson, Jr., Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S177000, C257S686000, C257S724000, C257SE23010, C257SE23141, C257SE25013
Reexamination Certificate
active
07732929
ABSTRACT:
A power semiconductor component (30) with power semiconductor chip stack (14) has a base power semiconductor chip (16) and a power semiconductor chip (17) stacked on the rear side of the base power semiconductor chip (16), a rewiring structure for the electrical coupling of the power semiconductor chips being arranged within the rear side metallization.
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Otremba Ralf
Schloegel Xaver
Banner & Witcoff , Ltd.
Chen Yu
Infineon - Technologies AG
Jackson, Jr. Jerome
LandOfFree
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