Patent
1982-09-17
1985-05-28
James, Andrew J.
357 82, H01L 2334, H01L 2346
Patent
active
045203830
ABSTRACT:
A power semiconductor component is used for boiling cooling of a power semiconductor crystal disc having two main electrodes, and optionally one or more control electrodes. Two multicontacts are provided, each being electrically connected to a respective one of the main electrodes for thermal and mechanical relief. Two heat sinks are provided, each being in electrical and thermal contact with a respective one of the multicontacts. Connecting eyes are integral with the heat sinks for electrically connecting the main electrodes. A liquid and gas-tight housing surrounds the semiconductor crystal disc, the housing including a ceramic sleeve having a boiling liquid space formed therein and metallic covers disposed laterally on the ceramic sleeve, the connecting eyes protrude through and are connected to the metallic covers, and an insulating sleeve is molded around the housing. The insulating sleeve has at least one stub formed thereon having a hole formed therein for conducting an electrically-insulating refrigerant flow through the housing directly contacting the semiconductor disc, the metallic covers have partially circular cutouts formed therein and the ceramic sleeve has a hole formed therein for the refrigerant flow.
REFERENCES:
patent: 3746947 (1973-07-01), Yamamoto et al.
patent: 3823771 (1974-07-01), Ludwig
patent: 3921201 (1975-11-01), Eisele et al.
patent: 4183042 (1980-01-01), Novak et al.
BBC Aktiengesellschaft Brown, Boveri & Cie.
Clark Sheila V.
Greenberg Laurence A.
James Andrew J.
Lerner Herbert L.
LandOfFree
Power semiconductor component for boiling cooling does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Power semiconductor component for boiling cooling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power semiconductor component for boiling cooling will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-871421