Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2008-12-17
2010-10-19
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S675000, C438S122000
Reexamination Certificate
active
07816784
ABSTRACT:
Disclosed are PQFN semiconductor die packages for high-voltage, high-power applications, systems using the packages, and methods of making the packages. An exemplary package comprises a leadframe, a semiconductor die disposed on the leadframe, and a heat sink member disposed on the semiconductor die and the leadframe and integrated into the molding material of the package. The heat sink member has an electrically insulating substrate with a high breakdown voltage, and one or more conductive layers disposed on a first surface of the substrate that electrically interconnect the semiconductor to one or more leads of the leadframe.
REFERENCES:
patent: 6777800 (2004-08-01), Madrid et al.
patent: 7022548 (2006-04-01), Joshi et al.
patent: 7061080 (2006-06-01), Jeun et al.
patent: 7081666 (2006-07-01), Joshi et al.
patent: 7208819 (2007-10-01), Jeun et al.
patent: 7285849 (2007-10-01), Cruz et al.
patent: 7315077 (2008-01-01), Choi et al.
patent: 7332806 (2008-02-01), Joshi et al.
patent: 2004/0207052 (2004-10-01), Joshi et al.
patent: 2006/0284291 (2006-12-01), Joshi et al.
patent: 2007/0114642 (2007-05-01), Hosoyamada et al.
patent: 2007/0132091 (2007-06-01), Wu et al.
patent: 2007/0200209 (2007-08-01), Fukuzono
patent: 2007/0241431 (2007-10-01), Manatad
patent: 2007/0249092 (2007-10-01), Joshi et al.
patent: 2008/0023807 (2008-01-01), Noquil et al.
patent: 2008/0173991 (2008-07-01), Cruz et al.
patent: 2009/0057855 (2009-03-01), Quinones et al.
patent: 2009/0115037 (2009-05-01), How et al.
patent: 2009/0236708 (2009-09-01), Shi et al.
patent: 2009/0302444 (2009-12-01), Ueda et al.
Jereza Armand Vincent
Manatad Romel N.
Son Joon-Seo
Clark S. V
Fairchild Semiconductor Corporation
Townsend and Townsend / and Crew LLP
LandOfFree
Power quad flat no-lead semiconductor die packages with... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Power quad flat no-lead semiconductor die packages with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power quad flat no-lead semiconductor die packages with... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4175928