Power module with lowered inductance and reduced voltage oversho

Details Power module with lowered inductance and reduced voltage oversho Power module with lowered inductance and reduced voltage oversho

1998-10-06

2000-05-30

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257692, H01L 2334

Patent

active

060694033

ABSTRACT:
A power module includes a semiconductor substrate and spaced power transistor circuits formed in the substrate, each having respective anode and cathode portions. A power module housing substantially encloses the substrate. Flexible cathode straps and flexible anode straps are connected to the respective anode and cathode portions and extend out of the power module housing spaced from each other. At least two anode straps and cathode straps fold over at least a portion of the power module housing to overlap each other and form phase straps. The remaining cathode and anode straps fold over at least a portion of the power module housing such that respective cathode and anode straps overlap each other, thereby lowering inductance and reducing voltage overshoots at turn off.

REFERENCES:
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patent: 5559668 (1996-09-01), Kuriyama
patent: 5576927 (1996-11-01), Sekiguchi
patent: 5600178 (1997-02-01), Russell

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