Power module and its manufacturing method

Details Power module and its manufacturing method Power module and its manufacturing method

2006-09-05

2006-09-05

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

07101793

ABSTRACT:
A method of manufacturing a power module is implemented which allows easy electrical connections between a control board and relay terminals. The diameter of through holes in the control board tapers down from a side of penetration of the relay terminals in a direction of the penetration, and respective one ends of the relay terminals have a smaller diameter than the other portions of the relay terminals. The diameter of the through holes on the side of penetration of the relay terminals is made sufficiently greater than the diameter of the one ends of the relay terminals, so that the relay terminals can easily penetrate the through holes. Further, even if the relay terminals are formed in deviated positions, the one ends of the relay terminals can be guided along the walls of the through holes in the penetration, so that the relay terminals can be adjusted to proper positions.

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