Power management with packaged multi-die integrated circuit

Details Power management with packaged multi-die integrated circuit Power management with packaged multi-die integrated circuit

2011-08-02

2011-08-02

Rinehart, Mark (Department: 2111)

Electrical computers and digital processing systems: support

Computer power control

Power conservation

C713S300000, C713S323000, C713S324000

Reexamination Certificate

active

07992020

ABSTRACT:
Power management with a packaged multi-die integrated circuit (IC) is described. A first integrated circuit die is capable of a first operational mode. A second integrated circuit die is coupled to the first integrated circuit die. The first integrated circuit die has a rate of power consumption that is lower than the second integrated circuit die when the first integrated circuit die is in the first operational mode and the second integrated circuit die is in a second operational mode. The first integrated circuit die is configured for power management of the second integrated circuit die for placing the second integrated circuit die in a standby mode from the second operational mode and for returning the second integrated circuit die to the second operational mode from the standby mode.

REFERENCES:
patent: 5809223 (1998-09-01), Lee et al.
patent: 7613934 (2009-11-01), Hou et al.
patent: 7739528 (2010-06-01), Zhuang et al.

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