Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-09-12
2006-09-12
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S699000, C361S717000, C361S719000, C257S714000, C257S715000
Reexamination Certificate
active
07106588
ABSTRACT:
The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe.
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European Search Report dated Jan. 4, 2005.
Degenkolb Thomas A.
Myers Bruce A.
Oberlin Gary E.
Peugh Darrel E.
Delphi Technologies Inc.
Funke Jimmy L.
Vortman Anatoly
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