Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
Inventor
active
Fluid cooled electronic assembly
Integrated circuit assembly with bar bond attachment
Method of producing an overmolded electronic module with a...
Multi-path bar bond connector for an integrated circuit...
Power electronic system with passive cooling
No associations
LandOfFree
Gary E. Oberlin does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Gary E. Oberlin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gary E. Oberlin will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2573292