Power device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Patent

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Details

257329, H01L 2362, H01L 2994

Patent

active

060780770

ABSTRACT:
A method for fabricating a field effect transistor using the supporting substrate as a device layer in accordance with the present invention comprises several steps. To fabricate the field effect transistor, an epitaxial layer is grown on one surface of a substrate having an opposing surface, the epitaxial layer forming a drain for the transistor. Once the epitaxial layer is grown, the substrate is thinned to an appropriate device thickness and then a gate and a source for the transistor are formed on the opposing surface of the substrate. In an alternative embodiment, a polysilicon layer is used instead of the epitaxial layer. A field effect transistor fabricated from the method described above includes an epitaxial layer formed on one surface of a substrate having an opposing surface, the epitaxial layer forming a drain for the transistor and a gate and a source for the transistor formed on the other surface of the substrate. Again, a polysilicon layer may be used instead of the epitaxial layer in the transistor.

REFERENCES:
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patent: 4729007 (1988-03-01), Coe
patent: 4946716 (1990-08-01), Corrie
patent: 4968628 (1990-11-01), Delgado et al.
patent: 5127984 (1992-07-01), Hua et al.
patent: 5208471 (1993-05-01), Mori et al.
patent: 5476566 (1995-12-01), Cavasin
patent: 5543645 (1996-08-01), Barret et al.
patent: 5612562 (1997-03-01), Siaudeau et al.

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