Potting material for electronic components

Details Potting material for electronic components Potting material for electronic components

2011-03-01

2011-03-01

Miggins, Michael C (Department: 1782)

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

C174S522000, C174S521000, C336S096000, C257S788000, C257S794000, C257S787000, C257S789000, C029S841000

Reexamination Certificate

active

07897234

ABSTRACT:
A potting compound for electronic components comprises a first composition of asphalt and sand and a second composition that attenuates the forces normally applied by the first composition when it is used alone. The force attenuator preferably comprises solvent-refined heavy paraffinic petroleum oil from about 0.1 to 20 wt % of the compound.

REFERENCES:
patent: 2083007 (1937-06-01), Delaney
patent: 4022635 (1977-05-01), Earing
patent: 4916363 (1990-04-01), Burton et al.
patent: 5386086 (1995-01-01), Sayles
patent: 5726386 (1998-03-01), Calhoun
patent: 6027557 (2000-02-01), Hayner

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