Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate
2006-05-16
2006-05-16
Osele, Mark A. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C156S583200, C438S464000
Reexamination Certificate
active
07045035
ABSTRACT:
A post singulation, die separation assembly for bulk separation of a plurality of dice in a singulated wafer from the adhesive backing of wafer saw tape. The die separation assembly includes a support base having a support surface. A feed tray includes a collection end positioned adjacent the base such that an elongated, substantially tin gap is formed between the tray collection end and at least a portion of the base. A flexible platform is movably supported atop the base support surface for movement along the base. Upon movement of the flexible platform down the down-ramped portion of the support base, a portion of the wafer saw tape thereat is peeled away from the respective die. The tape is the separated from the dice, releasing the respective dice onto the collection end of the feed tray in a manner substantially maintaining their forward alignment orientation of thereof.
REFERENCES:
patent: 4798645 (1989-01-01), Pak
patent: 5399228 (1995-03-01), Schroeder et al.
patent: 5482899 (1996-01-01), McKenna et al.
patent: 6364089 (2002-04-01), Singh et al.
patent: 2003/0071051 (2003-04-01), Martinsen
Patent Abstracts of Japan, Publication No. 52-027352,Sheet Separation Device, Sato Akihiko, et al., filed Aug. 27, 1975.
Bayan Jaime A.
Han Cheol Hyun
Kelkar Nikhil
Pham Ken
Beyer Weaver & Thomas LLP
National Semiconductor Corporation
Osele Mark A.
LandOfFree
Post singulation die separation apparatus and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Post singulation die separation apparatus and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Post singulation die separation apparatus and method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3537463