4. Measuring and testing
  5. With fluid pressure
  6. Leakage

Cheol Hyun Han

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Design of a two interconnect IC chip for a radio frequency...

Communications: radio wave antennas – Antennas – Loop type
Reexamination Certificate

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Die singulation using deep silicon etching

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Method and apparatus for hermeticity determination and leak...

Measuring and testing – With fluid pressure – Leakage
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Post singulation die separation apparatus and method for...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
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Post singulation die separation apparatus and method for...

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
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Profile ID: LFUS-PAI-P-2705303

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