Semiconductor device manufacturing: process – Making passive device
Reexamination Certificate
2008-07-10
2010-06-08
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Making passive device
C438S622000, C257SE21022
Reexamination Certificate
active
07732294
ABSTRACT:
A method of a semiconductor device. A substrate is provided. At least one metal wiring level is within the substrate. An insulative layer is deposited on a surface of the substrate. An inductor is formed within the insulative layer using a patterned plate process. A wire bond pad is formed within the insulative layer, wherein at least a portion of the wire bond pad is substantially co-planar with the inductor.
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Chinthakindi Anil Kumar
Coolbaugh Douglas Duane
Florkey John Edward
Gambino Jeffrey Peter
He Zhong-Xiang
Canale Anthony J.
International Business Machines - Corporation
Schmeiser Olsen & Watts
Trinh Michael
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