Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2007-01-02
2007-01-02
Fourson, George (Department: 2823)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S176000, C510S432000, C510S435000, C438S694000, C257SE21224, C257SE21228
Reexamination Certificate
active
10007134
ABSTRACT:
A new cleaning chemistry based on a choline compound, such as choline hydroxide, is provided in order to address the problem of dual damascene fabrication. An etch stop inorganic layer at the bottom of a dual damascene structure protects the underlying interconnect of copper and allows a better cleaning. A two step etch process utilizing the etch stop layer is used to achieve the requirements of ULSI manufacturing in a dual damascene structure.
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Arkless Leslie W.
Lee Shihying
Lee Wai Mun
Maloney David J.
Peyne Catherine M.
EKC Technology, Inc.
Fourson George
Maldonado Julio J.
Morgan & Lewis & Bockius, LLP
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