Positive-working resist composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S905000, C430S921000

Reexamination Certificate

active

10417209

ABSTRACT:
A positive-working resist composition comprising (A1) a resin containing a repeating unit represented by the specific general formula, wherein the resin increases the solubility in an alkali developing solution by the action of an acid.

REFERENCES:
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patent: 1243968 (2002-09-01), None
patent: 1273969 (2003-01-01), None
patent: 2002322217 (2002-11-01), None
patent: 2003295442 (2003-10-01), None
patent: WO 00/17712 (2000-03-01), None
English language abstract of JP 2002-322217.
R.R. Kunz et al., “Outlook for 157-nm resist design”, Part of the SPIE Conference on Advances In Resist Technology and Processing XVI, vol. 3678, pp. 13-23 (1999).
Dirk Schmaljobann et al., “Design Strategies for 157 nm Signle-Layer Photoresists: Lithographic Evaluation of a Poly(α-trifluoromethyl vinyl alcohol) Copolymer” In Advances in Resist Technology and Processing XVII, Proceedings of SPIE vol. 3999, pp. 330-333 (2000).
Theodore H. Fedynyshyn et al., “Prospects for Using Existing Resists for Evaluating 157-nm Imaging Systems”, In Advances in Resist Technology and Processing XVII, Proceedings of SPIE vol. 3999, p. 335 (2000).
Michael K. Crawford et al., “New Materials for 157 nm Photoresists: Characterization and Properties”, In Advances in Resist Technology and Processing XVII, Proceedings of SPIE vol. 3999, pp. 357-364 (2000).
Kyle Patterson et al., “Polymers for 157 nm Photoresist Applications: A Progress Report”, In Advances in Resist Technology and Processing XVII, Proceedings of SPIE vol. 3999, pp. 365-373 (2000).

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